Prediction of thermal performance of flip chip - Plastic ball grid array (FC-PBGA) packages: Effect of substrate physical design

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 528-537

  Ramakrishna, K ^a   Lee, T Y Tom ^b  

^a MOTOROLA INC   (United States)

^b Interconnect Systems Laboratory   (United States)

Author keywords

Flip chip plastic ball grid array packages (FC PBGA); HDI; Substrate physical design; Substrate thermal conductivity; Thermal performance

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEAT TRANSFER; THERMAL CONDUCTIVITY;

THERMAL PERFORMANCE;

HEAT RESISTANCE;

EID: 0036455577     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

1. K. Ramakrishna and T.-Y. T. Lee, 2001, "Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Part h Effect of Die Sizes," in Proceedings of 2001 ASME International Mechanical Engineering Congress and Exposition, Heat Transfer Division, Paper no.: IMECE2001/HTD-24387 pp. 1-9, held in New York, NY (November 11-16, 2001).
2. th IEEE Semi-Therm Symp., pp. 1-9, held in Austin, TX (January 27-28, 1997).
3. th Intersociety Conf. on Thermal and Thermo-mechanical Phenomena in Electronic Systems, (to be held in San Diego, CA, May 29-June 1, 2002), C.H. Amon, K. Ramakrishna, B.G. Sammakia, G. Subbarayan, S.B. Sathe and Y.K. Joshi (editors), sponsored by IEEE CPMT Soc.
4. J.-J. Hwang, 1998, "Conjugate heat transfer for developing flow over multiple discrete thermal sources flush-mounted on the wall," Trans. ASME, J. of Heat Transfer, vol. 120, no. 2, pp. 510-514.
5. th Annual IEEE Semiconductor Thermal Measurement and Management Symp.. pp. 36-42, held in Austin, TX (5-7 March 1996).
6. D. Mukutmoni, Y.K. Joshi, and M.D. Kelleher, 1995, "Computations for a three-by-three array of protrusions cooled by liquid immersion: Effect of substrate thermal conductivity," Trans. ASME, J. of Electronic Packaging, vol. 117, no. 4 pp.294-300.
7. S.H. Kim and N.K. Anand, 1994, "Laminar developing flow and heat transfer between a series of parallel plates with surface mounted discrete heat sources," Intl. J. of Heat and Mass Transfer, vol. 37, no. 15, pp. 2231-2244.
8. S.H. Kim and N.K. Anand, 1995, "Laminar heat transfer between a series of parallel plates with surface-mounted discrete heat sources," Trans. ASME, J. of Electronic Packaging, vol. 117, no. 1 pp. 52-62.
9. C.Y. Choi, S.J. Kim, and A. Ortega, 1994, "Effects of substrate conductivity on convective cooling of electronic components," Trans. ASME, J. of Electronic Packaging vol. 116, no. 3 pp. 198-205.
10. R. Sugavanam, A. Ortega, and C.Y. Choi, 1994, "A numerical investigation of conjugate heat transfer from a flush heat source on a conductive board in laminar channel flow," Proc. of I-THERM IV: The InterSociety Conf. on Thermal Phenomena in Electronic Systems, pp. 62-72, held in Washington, DC (4-7 May 1994).
11. 3 and BeO power hybrid structures," Proc. of the Technical Conference: 1992 International Electronics Packaging Conf., vol. 2, pp. 1105-1119 held in Austin, TX (27-30 September 1992).
12. EIA/JESD51-7, 1999, "High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages" Electronic Industries Association, Engineering Department, Arlington, VA.
13. EIA/JESD51-5, 1999, "Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanism," Electronic Industries Association, Engineering Department, Arlington, VA.
14. Flotherm User's Guide and Reference Manual for version 2.2 (released September 1999), 1999, Surrey, England.
15. K. Ramakrishna and J.R. Trent, 1997, "Parametric Study of Thermal Performance of a Three Chip, Single Package Technology for Automotive Applications," in "CAD/CAE and Thermal Management Issues in Electronic Systems" D. Agonafer et. al. (editors), ASME Electrical " Electronic Packaging Division, pp. 13-21, EEP-Vol. 23 " HTD-Vol. 356, ASME International Mechanical Engineering Conf. " Exposition held in Dallas, TX (November 16-21, 1997).
16. th Intersociety Conf. on Thermal and Thermo-mechanical Phenomena in Electronic Systems, (Seattle, WA, May 27-30, 1998), S.H. Bhavnani, G.B. Kromann " D.J. Nelson (editors), IEEE CPMT Soc., pp. 27-34.
17. F. Kreith, and M.S. Bohn, 1986, "Principles of Heat Transfer," 4th edition, Harper " Row Publishers, New York, NY.
18. V.H. Adams and K. Ramakrishna 1999, "Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages," in "Electronics Manufacturing Issues," C. Sahay, B. Sammakia, I. Kao, " D. Baldwin, (editors), Proc. of the 1999 ASME Intl. Mech. Engg. Conference and Expostion, Nashville, TN, November 14-19, 1999, ASME Vol. EEP-Vol. 104, pp. 99-106.