Prediction of thermal performance of a wire-bonded plastic ball grid array package for underhood automotive applications

Journal of Electronic Packaging

Volumn 125, Issue 3, 2003, Pages 447-455

  Ramakrishna, K ^a   Trent, J R ^a,b  

^a MOTOROLA INC   (United States)

^b NEC Electronics North America Inc ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE ENGINEERING; COMPUTATIONAL METHODS; MATHEMATICAL MODELS; NATURAL CONVECTION; PRINTED CIRCUIT BOARDS; SUBSTRATES; THERMAL CONDUCTIVITY; THERMODYNAMIC PROPERTIES;

AUTOMOTIVE APPLICATION; MULTI-DIMENSIONAL HEAT TRANSFER EFFECT; WIRE-BONDED PLASTIC BALL GRID ARRAY;

ELECTRONICS PACKAGING;

EID: 0142055900     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1602710     Document Type: Article

References (27)

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