Relaxation of gold/polysilicon layered MEMS microstructures subjected to thermal loading

American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)

Volumn 3, Issue , 2001, Pages 149-156

  Zhang, Yanhang ^a   Dunn, Martin L ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MULTILAYER MATERIAL SYSTEMS; SPATIALLY NONUNIFORM CURVATURES;

FABRICATION; GOLD; ISOTHERMS; MICROELECTRONICS; MICROMACHINING; MICROSTRUCTURE; POLYSILICON; STRESS RELAXATION; THERMAL CYCLING; THERMAL EFFECTS; THERMAL LOAD;

MICROELECTROMECHANICAL DEVICES;

EID: 1542537635     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

1. Dunn, M. L., Zhang, Y., and Bright, V. M., 2000, "Linear and Geometrically Nonlinear Behavior of Metal/Polysilicon Plate Microstructures Subjected to Temperature Changes," in Proceedings of the MEMS Symposium, ASME International Mechanical Engineering Congress and Exposition, A. P. Lee, A. P. Malshe, F. K. Forster, R. S. Keynton, and Q. Tan, MEMS-Vol. 2, pp. 207-213.
2. Dunn, M. L., Zhang, Y., and Bright, V., 2001, "Deformation and Structural Stability of Layered Plate Microstructures Subjected to Thermal Loading." submitted for publication.
3. Fahnline, D. E., Masters, C. B., and Salamon, N. J., 1991, "Thin Film Stress from Nonspherical Substrate Bending Measurements," J. Vac. Sci. Technol. A, Vol. 9, pp. 2483-2487.
4. Finot, M. and Suresh, S., 1996, "Small and Large Deformation of Thick and Thin Film Multilayers: Effects of Layer Geometry, Plasticity and Compositional Gradients," J. Mech. Phys. Solids, Vol. 44, pp. 683-721.
5. Finot, M., Blech, I. A., Suresh, S., and Fujimoto, H., 1997, "Large Deformation and Geometric Instability of Substrates with Thin Film Deposits," J. Appl. Phys., Vol. 81, pp. 3457-3464.
6. Freund, L. B., Flora, J. A., and Chason, E., 1999, "Extension of the Stoney Formula for Substrate Curvature to Configurations with Thin Substrate or Large Deformations," Applied Physics Letters, Vol. 74, pp. 1987-1989.
7. Freund, L. B., 2000, "Substrate Curvature due to Thin Film Mismatch Strain in the Nonlinear Deformation Range," J. Mech. Phys. Solids, Vol. 48, pp. 1159-1174.
8. Gall, K., Dunn, M. L., Zhang, Y., and Corff, B., 2001, "Thermal Cycling Response of Layered Gold/Silicon MEMS Structures," submitted for publication.
9. Keller, R. M., Baker, S. P., and Arzt, E., 1999, "Stress-Temperature Behavior of Unpassivated Thin Copper Films," Acta Mater., Vol. 47, pp. 415-426.
10. King, J. A., 1988, Materials Handbook for Hybrid Microelectronics, Teledyne Microelectronics, Los Angeles, California.
11. Koester, D. A., Mahadevan, R., Hardy, B., and Markus, K. W., 2001, MUMPs™ Design Rules, Cronos Integrated Microsystems, A JDS Uniphase Company, http://www.memsrus.com/cronos/svcsrules.html
12. Leung, O. S., Munkholm, A., Brennan, S., and Nix, W. D., "A Search for Strahl Gradients in Gold Thin Films on Substrate Using X-Ray Diffraction," 2000, Journal of Applied Physics, Vol. 88, pp. 1389-1396.
13. Masters, C. B. and Salamon, N. J., 1993, "Geometrically Nonlinear Stress-Deflection Relations for Thin Film/Substrate Systems," Int. J. Engng. Sci., Vol. 31, pp. 915-925.
14. Sharpe W. N., Yuan B., and Edwards R. L., 1997, "A New Technique for Measuring the Mechanical Properties of Thin Films," Journal of Microelectromechanical Systems, Vol. 6, pp. 193-199.
15. Sharpe W. N., Turner, K. T., and Edwards R. L., 1999, "Tensile Testing of Polysilicon," Experimental Mechanics, Vol. 39, pp. 162-170.
16. Shen, Y. L. and Suresh, S., 1995, "Thermal Cycling and Stress Relaxation Response of Si-Al and Si-Al-SiO2 Layered Thin Films," Acta Metall. Mater., Vol. 43, pp. 3915-3926.
17. Stoney, G. G., 1909, "The Tension of Metallic Films Deposited by Electrolysis," Proc. Roy. Soc. London, Vol. A82, pp. 172-175.
18. Thouless, M. D., Cupta, J., and Harper, J. M. E., 1993, "Stress Development and Relaxation in Copper Films During Thermal Cycling," J. Mater. Res., Vol. 8, pp. 1845-1852.
19. Thouless, M. D. 1995, "Modeling the Development and Relaxation of Stresses in Films," Annu. Rev. Mater. Sci., Vol. 25, pp. 69-96.