Fracture strength of polysilicon thin films at stress concentrations

Materials Research Society Symposium - Proceedings

Volumn 687, Issue , 2002, Pages 285-290

  Bagdahn, J ^a   Sharpe Jr , W N ^a  

^a Johns Hopkins University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; FRACTOGRAPHY; FRACTURE MECHANICS; MECHANICAL VARIABLES MEASUREMENT; MICROELECTROMECHANICAL DEVICES; STRENGTH OF MATERIALS; STRESS ANALYSIS; STRESS CONCENTRATION; TENSILE TESTING; THIN FILMS;

FRACTURE STRESS; STRAIGHT TENSILE;

POLYSILICON;

EID: 0036351687     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)