Local microstructure and stress in Al(Cu) thin film structures studied by x-ray microdiffraction

Materials Research Society Symposium - Proceedings

Volumn 673, Issue , 2001, Pages

  Valek, B C ^a   Tamura, N ^a   Spolenak, R ^a   MacDowell, A A ^a   Celestre, R S ^a   Padmore, H A ^a   Bravman, J C ^a   Brown, W L ^a   Batterman, B W ^a   Patel, J R ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; CRYSTAL ORIENTATION; DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; METALLOGRAPHIC MICROSTRUCTURE; PASSIVATION; RESIDUAL STRESSES; STRAIN MEASUREMENT; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

BLANKET FILMS; LOCAL STRAIN STRESS GRADIENTS; STRESS MAPPING; X RAY MICRODIFFRACTION BEAM LINE;

THIN FILMS;

EID: 0035557844     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-673-p7.7     Document Type: Conference Paper

References (14)