-
1
-
-
0036686431
-
-
V. Kumar, W. Lu, R. Schwindt, A. Kuliev, G. Simin, J. Yang, M. Asif Khan, and I. Adesida, IEEE Electron Device Lett. 23, 455 (2002).
-
(2002)
IEEE Electron Device Lett.
, vol.23
, pp. 455
-
-
Kumar, V.1
Lu, W.2
Schwindt, R.3
Kuliev, A.4
Simin, G.5
Yang, J.6
Asif Khan, M.7
Adesida, I.8
-
2
-
-
0033314092
-
-
Y.-F. Wu, D. Kapolnek, J. Ibbetson, N.-Q. Zhang, P. Parikh, B. P. Keller, and U. K. Mishra, Tech. Dig. - Int. Electron Devices Meet. 943, 925 (1999).
-
(1999)
Tech. Dig. - Int. Electron Devices Meet.
, vol.943
, pp. 925
-
-
Wu, Y.-F.1
Kapolnek, D.2
Ibbetson, J.3
Zhang, N.-Q.4
Parikh, P.5
Keller, B.P.6
Mishra, U.K.7
-
3
-
-
0035934801
-
-
X. Hu, A. Koudymov, G. Simin, J. Yang, M. Asif Khan, A. Tarakji, M. S. Shur, and R. Gaska, Appl. Phys. Lett. 79, 2832 (2001).
-
(2001)
Appl. Phys. Lett.
, vol.79
, pp. 2832
-
-
Hu, X.1
Koudymov, A.2
Simin, G.3
Yang, J.4
Asif Khan, M.5
Tarakji, A.6
Shur, M.S.7
Gaska, R.8
-
5
-
-
0036477580
-
-
M. E. Levinshtein, S. L. Rumyantsev, M. S. Shur, R. Gaska, and M. Asif Khan, IEE Proc.-G: Circuits, Devices Syst. 149, 32 (2002).
-
(2002)
IEE Proc.-G: Circuits, Devices Syst.
, vol.149
, pp. 32
-
-
Levinshtein, M.E.1
Rumyantsev, S.L.2
Shur, M.S.3
Gaska, R.4
Asif Khan, M.5
-
7
-
-
0034227939
-
-
A. Kumar, E. Kalra, S. Haldar, and R. S. Gupta, IEEE Trans. Electron Devices 47, 1426 (2000).
-
(2000)
IEEE Trans. Electron Devices
, vol.47
, pp. 1426
-
-
Kumar, A.1
Kalra, E.2
Haldar, S.3
Gupta, R.S.4
-
19
-
-
0029406766
-
-
E. P. Vandamme, L. K. J. Vandamme, C. Claes, E. Simoen, and R. J. Schreutelkamps, Solid-State Electron. 38, 1893 (1995).
-
(1995)
Solid-State Electron.
, vol.38
, pp. 1893
-
-
Vandamme, E.P.1
Vandamme, L.K.J.2
Claes, C.3
Simoen, E.4
Schreutelkamps, R.J.5
-
21
-
-
0033221993
-
-
M. A. Khan, J. W. Yang, G. Simin, H. zur Loye, R. Bicknell-Tassius, R. Gaska, M. S. Shur, G. Tamulaitis, and A. Zukauskas, Phys. Status Solidi A 176, 227 (1999); J. B. Webb, H. Tang, S. Rolfe, and J. A. Baedwell, Appl. Phys. Lett. 75, 953 (1999).
-
(1999)
Phys. Status Solidi A
, vol.176
, pp. 227
-
-
Khan, M.A.1
Yang, J.W.2
Simin, G.3
Zur Loye, H.4
Bicknell-Tassius, R.5
Gaska, R.6
Shur, M.S.7
Tamulaitis, G.8
Zukauskas, A.9
-
22
-
-
0000789654
-
-
M. A. Khan, J. W. Yang, G. Simin, H. zur Loye, R. Bicknell-Tassius, R. Gaska, M. S. Shur, G. Tamulaitis, and A. Zukauskas, Phys. Status Solidi A 176, 227 (1999); J. B. Webb, H. Tang, S. Rolfe, and J. A. Baedwell, Appl. Phys. Lett. 75, 953 (1999).
-
(1999)
Appl. Phys. Lett.
, vol.75
, pp. 953
-
-
Webb, J.B.1
Tang, H.2
Rolfe, S.3
Baedwell, J.A.4
-
23
-
-
0035395422
-
-
S. L. Rumyantsev, N. Pala, M. S. Shur, R. Gaska, M. E. Levinshtein, M. A. Khan, G. Simin, X. Hu, and J. Yang, J. Appl. Phys. 90, 310 (2001).
-
(2001)
J. Appl. Phys.
, vol.90
, pp. 310
-
-
Rumyantsev, S.L.1
Pala, N.2
Shur, M.S.3
Gaska, R.4
Levinshtein, M.E.5
Khan, M.A.6
Simin, G.7
Hu, X.8
Yang, J.9
-
24
-
-
0025508097
-
-
J.-M. Peransin, P. Vignaud, D. Rigaud, and L. K. J. Vandamme, IEEE Trans. Electron Devices 37, 2250 (1990).
-
(1990)
IEEE Trans. Electron Devices
, vol.37
, pp. 2250
-
-
Peransin, J.-M.1
Vignaud, P.2
Rigaud, D.3
Vandamme, L.K.J.4
-
25
-
-
0038116140
-
-
unpublished
-
Depending on the surface preparation, passivation, etc., the open surface might strongly contribute to LFN; see, for example, S. L. Rumyantsev, Y. Deng, S. Shur, M. E. Levinshtein, M. Asif Khan, G. Simin, J. Yang, X. Hu, and R. Gaska (unpublished).
-
-
-
Rumyantsev, S.L.1
Deng, Y.2
Shur, S.3
Levinshtein, M.E.4
Asif Khan, M.5
Simin, G.6
Yang, J.7
Hu, X.8
Gaska, R.9
-
26
-
-
0036477009
-
-
A. Penarier, S. G. Jarrix, C. Delseny, F. Pascal, J. C. Videuli, M. Valenza, and D. Rigaud, IEE Proc.-G: Circuits, Devices Syst. 149, 59 (2002).
-
(2002)
IEE Proc.-G: Circuits, Devices Syst.
, vol.149
, pp. 59
-
-
Penarier, A.1
Jarrix, S.G.2
Delseny, C.3
Pascal, F.4
Videuli, J.C.5
Valenza, M.6
Rigaud, D.7
|