Ultra low dielectric constant silsesquioxane based resin

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 196-197

  Mover, Eric S ^a   Chung, K ^a   Spaulding, M ^a   Deis, T ^a   Boisvert, R ^a   Saha, C ^a   Bremmer, J ^a  

^a DOW CORNING CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL ENGINEERING;

COPPER DAMASCENE PROCESS; CRACK-FREE FILMS; ELECTRICAL AND MECHANICAL PROPERTIES; K-VALUES; LOW-DIELECTRIC CONSTANT FILM; SILSESQUIOXANES; ULTRA-LOW DIELECTRIC CONSTANT;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 85039946086     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787120     Document Type: Conference Paper

References (2)

1. The National Technology Roadmap for Semiconductors, 1997 Edition (Semiconductor Industry Association, San Jose, CA, 1997).
2. J. Hedrick, R. Miller, C. Hawker, K. Carter, W. Volksen, D. Yoon, M. Trollsas; Adv. Mater. 1998, 10, 1049.