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Volumn 409, Issue 1, 2002, Pages 147-152

Effect of the neutral ligand (L) on the characteristics of hexafluoroacetylacetonate (hfac)Cu(I)-L precursor and on the copper deposition process

(2) Choi, Kyeong Keun a Rhee, Shi Woo a

a Pohang University of Science and Technology (POSTECH) (South Korea)

Author keywords

Chemical vapor deposition; Copper; Copper precursor; Metallization

Indexed keywords

CHEMICAL BONDS; CHEMICAL VAPOR DEPOSITION; COPPER; DEPOSITION; ELECTRIC RESISTANCE; LOW TEMPERATURE EFFECTS; METALLIZING; MOLECULAR WEIGHT; MORPHOLOGY; THERMAL EFFECTS; THERMODYNAMIC STABILITY; VAPOR PRESSURE;

HEXAFLUOROACETYLACETONATE;

THIN FILMS;

EID: 0037156029 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(02)00118-9 Document Type: Conference Paper

Times cited : (16)

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