In-situ electromigration damage of al interconnect lines and the influence of grain orientation

Materials Research Society Symposium - Proceedings

Volumn 563, Issue , 1999, Pages 109-114

  Buerke, A ^a   Wendrock, H ^a   Kotter T ^a   Menzel, S ^a   Wetzig, K ^a   Glasow, A V ^b  

^a IFW DRESDEN   (Germany)

^b SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CRYSTAL ORIENTATION; DIFFUSION IN SOLIDS; ELECTROMIGRATION; GRAIN BOUNDARIES; METALLOGRAPHIC MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY;

ELECTROMIGRATION DAMAGE; POLYGRAINED STRUCTURE;

ELECTRIC CONTACTS;

EID: 0033284698     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-563-109     Document Type: Article

References (8)

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