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Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

Volumn 20, Issue 3, 2002, Pages 733-740

Interfacial mechanism studies of electroless plated Cu films on a-Ta:N layers catalyzed by PIII

(6) Lin, Jian Hong a Lee, Tzu Li b Hsieh, Wei Jen a Lin, Chien Cheng b Kou, Chwung Shan a Shih, Han C a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

b NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS MATERIALS; AUGER ELECTRON SPECTROSCOPY; CATALYSIS; ELECTROLESS PLATING; HIGH RESOLUTION ELECTRON MICROSCOPY; ION IMPLANTATION; PALLADIUM; PLASMA APPLICATIONS; TANTALUM COMPOUNDS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

AMORPHOUS TANTALUM NITRIDE BARRIER LAYER; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; PLASMA IMMERSION ION IMPLANTED;

COPPER;

EID: 0036564770 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.1465448 Document Type: Article

Times cited : (10)

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