Electron microscopy studies of ion implanted silicon for seeding electroless copper films

Journal of Applied Physics

Volumn 83, Issue 11, 1998, Pages 5709-5713

  Muralidhar, G K ^a   Bhansali, S ^a   Pogany, A ^a,b   Sood, D K ^a  

^a RMIT UNIVERSITY   (Australia)

^b CSIRO   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLESS PLATING; GRAIN SIZE AND SHAPE; ION IMPLANTATION; IONS; PALLADIUM; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; SURFACES; THIN FILMS; TOPOLOGY; TRANSMISSION ELECTRON MICROSCOPY;

CHEMICAL THINNING; ELECTROLESS FILM; IMPLANTATION DOSE; ION BEAM THINNING; METAL VAPOR VACUUM ARC; METALLIC CLUSTER; SEEDING;

SILICON WAFERS;

EID: 0032095331     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.367425     Document Type: Article

References (11)

1. R. Junginger and G. Eisner, J. Electrochem. Soc. 135, 2304 (1988).
2. S. Nakahara, Y. Okinaka, and H. K. Straschil, J. Electrochem. Soc. 136, 1120 (1989).
3. S. Bhansali and D. K. Sood, Thin Solid Films 253, 391 (1994).
4. S. Bhansali and D. K. Sood, Thin Solid Films 270, 489 (1995).
5. S. Bhansali and D. K. Sood, Sens. Actuators A 52, 126 (1996).
6. S. Bhansali, D. K. Sood, P. J. Evans, and I. G. Brown, Sens. Actuators A 62, 705 (1997).
7. H. Krautle and S. Kalbitzer, in Ion Implantation in Semiconductors and Other Materials, edited by B. L. Cowder (Plenum, New York, 1973), p. 585.
8. I. G. Brown and X. Godechot, IEEE Trans. Plasma Sci. 19, 713 (1991).
9. M. A. Nicolet and S. S. Lau, in VLSI Electronics Microstructure Science, edited by N. G. Einspruch and G. B. Larrabee (Academic, Florida, 1983), Vol. 6, p. 336.
10. Z. F. Zeigler and Biersack, TRIM-91 (computer program).
11. R. H. Magruder III, D. L. Kinser, J. E. Wittig, and R. A. Zuhr, "Structure Property Relationships of Nanometer Size Clusters in Glasses" (preprint).