Failure mechanism of Ta diffusion barrier between Cu and Si

Journal of Applied Physics

Volumn 88, Issue 6, 2000, Pages 3377-3384

  Laurila, Tomi ^a   Zeng, Kejun ^a   Kivilahti, Jorma K ^a   Molarius, Jyrki ^b   Suni, Ilkka ^b  

^a AALTO UNIVERSITY   (Finland)

^b VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001559994     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1288692     Document Type: Article

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