Flip chip as an enabler for MEMS packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 124-128

  Boustedt, Katarina ^a   Persson, Katrin ^b   Stranneby, Dag ^a  

^a ÖREBRO UNIVERSITY   (Sweden)

^b Imego AB The Institute of Micro and Nanotechnology   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHIP SCALE PACKAGES; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS;

WAFER BONDING;

FLIP CHIP DEVICES;

EID: 0036287484     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008084     Document Type: Article

References (20)

1. Overview of new packages, materials and processes
2. Challenges in interconnection and packaging of microelectromechanical systems (MEMS)
3. Packaging for volume production of micro electromechanical systems - A great challenge
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5. Microrelays for batch transfer integration in RF systems
6. Microrelay packaging technology using flip-chip assembly
7. Stacking technology for a space constrained microsystem
8. Batch transfer of microstructures using flip-chip solder bump bonding
9. A fully-packaged electromagnetic microrelay
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11. Advanced flip chip bonding technique for MCM-L
12. Properties of SBB flip chip for microsystems
13. The first low voltage, low noise differential silicon microphone, technology development and measurement result
14. A new flip-chip bonding technique using micromachined conductive polymer bumps
15. Quick prototyping of flip chip assembly with MEMS
16. Bulk-etched surface micromachined and flip-chip integrated micromirror array for infrared applications
17. Flip-chip assembly for Si-based RF MEMS
18. Batch transfer of LIGA microstructures by selective electroplating and bonding