Fully-packaged electromagnetic microrelay

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1999, Pages 25-30

  Tilmans, H A C ^a   Fullin, E ^a   Ziad, H ^a   Van de Peer, M D J ^a   Kesters, J ^a   Van Geffen, E ^a   Bergqvist, J ^a   Pantus, M ^a   Beyne, E ^a   Baert, K ^a   Naso, F ^a  

^a CP Clare Corporation   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC COILS; ELECTRIC CONTACTS; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRIC RELAYS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT MANUFACTURE; MICROACTUATORS; SOLDERING;

ELECTROMAGNETIC MICRORELAYS;

MICROELECTROMECHANICAL DEVICES;

EID: 0032689729     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)