A new flip-chip bonding technique using micromachined conductive polymer bumps

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 4, 1999, Pages 586-591

  Oh, Kwang W ^a   Ahn, Chong H ^a  

^a University of Cincinnati   (United States)

Author keywords

Flip chip bonding; Low temperature bonding; Micromachined polymer bump; Thermoplastic conductive polymer

Indexed keywords

BONDING; CONDUCTIVE PLASTICS; FLIP CHIP DEVICES; MICROMACHINING; PHOTORESISTS; ULTRAVIOLET RADIATION;

FLIP-CHIP BONDING METHOD; MICROMACHINED CONDUCTIVE POLYMER BUMPS;

ELECTRONICS PACKAGING;

EID: 0033338716     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.803450     Document Type: Article

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