Packaging of CMOS MEMS

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1255-1262

  Baltes, Henry ^a   Brand, Oliver ^a   Waelti, Marc ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0009633075     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00110-4     Document Type: Article

References (9)

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3. Malshe A P, O'Neal C, Singh S B, Brown W D, Eaton W P, Miller W M. Challenges in the packaging of MEMS. J. Microcircuits and Electronic Packaging 22 (1999)2-10.
4. Frank R, Kniffin M L, Ristic L. Packaging for sensors. In: Ristic L (ed.), Sensor Technology and Devices, Artech House, 1994, pp. 203-238.
5. Hierold C. Intelligent CMOS sensors. Proc. IEEE MEMS 2000, 2000, pp. 1-6.
6. Grelland R, Jakobsen H, Liverod B. A low-cost, fully signal conditioned sensor microsystem with excellent media compatibility. In: Ricken D E, Gessner W (eds.) Advanced Microsystems for Automotive Applications 99. Springer, 1999, pp. 121-131.
7. Disposable Medical Pressure Sensor NPC 107. TRW NovaSensors, USA (http://www.novasensor.com).
8. Ohlckers P, Holm R, Jakobsen H, Kvisteroy T, Kittilsland G, Larsen A, Nese M, Nilsen S M, Ferber A. An integrated resonant accelerometer microsystem for automotive applications. Sensors and Actuators A 66 (1998) 99-104.
9. Baltes H, Paul O, Brand O. Micromachined thermally-based CMOS microsensors. Proceedings IEEE 86 (1998) 1660-1678.