Overview of new packages, materials and processes

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 1-5

  Gilleo, K ^a  

^a Cookson Electronics ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; COST EFFECTIVENESS; FLIP CHIP DEVICES; INTERNET; TELECOMMUNICATION; WAVELENGTH DIVISION MULTIPLEXING; WIRELESS TELECOMMUNICATION SYSTEMS;

MICRO-OPTO-ELRCTRO-MECHANICAL SYSTEMS (MOEMS);

CHIP SCALE PACKAGES;

EID: 0034998366     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)