Passivated interconnect lines: Thermomechanical analysis and curvature measurements

Materials Research Society Symposium - Proceedings

Volumn 594, Issue , 2000, Pages 439-444

  Wikstrom A ^a   Gudmundson, P ^a   Suresh, S ^b  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COPPER; FINITE ELEMENT METHOD; PASSIVATION; SILICA; STRESS ANALYSIS; X RAY DIFFRACTION ANALYSIS;

CURVATURE MEASUREMENT; INTERCONNECT LINES; ISOTROPIC ALUMINUM; ISOTROPIC COPPER;

SEMICONDUCTOR DEVICES;

EID: 0033652517     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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