SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium - Proceedings

Volumn 672, Issue , 2001, Pages

Crystallographic texture characterization of inlaid copper interconnects

(4) Zienert, Inka a Besser, Paul a Blum, Werner a Zschech, Ehrenfried a

a Materials Analysis Department (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; CURRENT DENSITY; ELECTROMIGRATION; GRAIN BOUNDARIES; GRAIN GROWTH; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); TEXTURES; TRANSPORT PROPERTIES;

COPPER INTERCONNECTS; CRYSTALLOGRAPHIC TEXTURE; ELECTRON BACKSCATTERED DIFFRACTION;

COPPER COMPOUNDS;

EID: 0035742248 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.