Microstructure and texture of electroplated copper in damascene structures

Materials Research Society Symposium - Proceedings

Volumn 514, Issue , 1998, Pages 293-298

  Gross, M E ^a   Lingk, C ^a   Siegrist, T ^a   Coleman, E ^a   Brown, W L ^a   Ueno, K ^a   Tsuchiya, Y ^a   Itoh, N ^a   Ritzdorf, T ^a   Turner, J ^a   Gibbons, K ^a   Klawuhn, E ^a   Biberger, M ^a   Lai, W Y C ^a   Miner, J F ^a   et al , ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; COPPER; ELECTROPLATING; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; REFRACTORY METALS; TEXTURES; X RAY DIFFRACTION;

FOCUSED ION BEAM IMAGES; TRANSMISSION ELECTRON MICROGRAPHS;

ELECTRIC WIRE;

EID: 0032301041     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-514-293     Document Type: Conference Paper

References (6)