CMOS-based microsensors and packaging

Sensors and Actuators, A: Physical

Volumn 92, Issue 1-3, 2001, Pages 1-9

  Baltes, Henry ^a   Brand, Oliver ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Ball bond characterization; Chemical sensor; CMOS; Infrared radiation sensor; Post processing; Thermal imager; Wire bonder calibration

Indexed keywords

BONDING; CALIBRATION; CHEMICAL SENSORS; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; INFRARED RADIATION; MICROELECTRONIC PROCESSING; MICROMACHINING; OPTIMIZATION; SEMICONDUCTOR DEVICE MANUFACTURE;

BALL BONDING PROCESS; INFRARED RADIATION SENSOR; THERMAL IMAGER; THIN FILM DEPOSITION; WIRE BONDER CALIBRATION;

MICROSENSORS;

EID: 0035426066     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00532-5     Document Type: Article

References (37)

1. Quo vadis silicon sensors?
2. First integrated inductive proximity sensor with onchip CMOS readout circuit and electrode-posited 1 mm flat coil
3. 2-D CMOS microfluxgate sensor system for digital detection of weak magnetic fields
4. Trench-Hall devices
5. Embedded micromechanical devices for monolithic integration of MEMS with CMOS
6. A merged MEMS-CMOS process using silicon wafer bonding
7. Surface micro-machining for microelectromechanical systems
8. Intelligent CMOS sensors
9. An integrated force-balanced capacitive accelerometer for low-g applications
10. A MEMS-based projection display
11. Application of MEMS technology in automotive sensors and actuators
12. Angular rate sensor and accelerometer combined on the same micromachined CMOS chip
13. Monolithic two-dimensional arrays of micromachined microstructures for infrared applications
14. Industrial fabrication technology for CMOS infrared sensor arrays
15. An industrial CMOS process family adapted for the fabrication of smart silicon sensors
16. Micromachined thermally based CMOS microsensors
17. Sacrificial aluminum etching for CMOS microstructures
18. Diode-based thermal rms converter with on-chip circuitry fabricated using standard CMOS technology
19. Laminated high-aspect-ratio microstructures in a conventional CMOS process
20. Monolithic pressure sensing system with digital signal processing
21. CMOS integration of a thermal pressure sensor system
22. Single-chip CMOS anemometer
23. CMOS integrated chemical microsensors and the electronic nose
24. Uncooled low-cost thermal imager using micromachined CMOS integrated sensor array
25. An industrial CMOS process family for integrated silicon sensors
26. Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array
27. Metal film protection of CMOS wafers against KOH
28. Packaging of CMOS IR microsystems
29. Fluxless microjoining by Au-In-Ni iso-thermal solidification
30. CMOS resonant beam gas sensor with integrated preamplifier
31. CMOS capacitive chemical microsystems for volatile organic compounds
32. CMOS capacitive chemical microsystem with active temperature control for discrimination of organic vapors
33. N-well based CMOS calorimetric chemical sensors
34. Flip-chip packaged CMOS chemical microsystem for detection of volatile organic compounds
35. Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process
36. In-situ ultrasonic stress measurements during ball bonding using integrated piezoresistive microsensors
37. Microelectronic bonding process monitoring by integrated sensors