Soft breakdown and hard breakdown in ultra-thin oxides

Microelectronics Reliability

Volumn 41, Issue 4, 2001, Pages 543-551

  Pompl, T ^a   Engel, C ^a   Wurzer, H ^a   Kerber, M ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC BREAKDOWN OF SOLIDS; MICROSCOPIC EXAMINATION; OXIDES; PHOTOEMISSION; STRESS ANALYSIS; ULTRATHIN FILMS;

PHOTOEMISSION MICROSCOPY (PEM); ULTRATHIN OXIDES;

MICROELECTRONICS;

EID: 0035310837     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00253-5     Document Type: Article

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