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Volumn 40, Issue 4 B, 2001, Pages 2810-2813

Degradation of Ta2O5 gate dielectric by TiCl4-based chemically vapor deposited TiN film in W/TiN/Ta2O5/Si system

Author keywords

Annealing; Chemical vapor deposition (CVD); Diffusion; Reduction; Residual Cl; Tantalum pentoxide; TiCl4; TiN; Void

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; GATES (TRANSISTOR); LEAKAGE CURRENTS; PHYSICAL VAPOR DEPOSITION; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTING FILMS; SEMICONDUCTING SILICON; TANTALUM COMPOUNDS; THERMAL DIFFUSION; THERMODYNAMIC STABILITY; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY;

EID: 0035300698     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.40.2810     Document Type: Article
Times cited : (2)

References (16)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.