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Volumn 40, Issue 4 B, 2001, Pages 2810-2813
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Degradation of Ta2O5 gate dielectric by TiCl4-based chemically vapor deposited TiN film in W/TiN/Ta2O5/Si system
a a a a |
Author keywords
Annealing; Chemical vapor deposition (CVD); Diffusion; Reduction; Residual Cl; Tantalum pentoxide; TiCl4; TiN; Void
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Indexed keywords
ANNEALING;
CHEMICAL VAPOR DEPOSITION;
GATES (TRANSISTOR);
LEAKAGE CURRENTS;
PHYSICAL VAPOR DEPOSITION;
SECONDARY ION MASS SPECTROMETRY;
SEMICONDUCTING FILMS;
SEMICONDUCTING SILICON;
TANTALUM COMPOUNDS;
THERMAL DIFFUSION;
THERMODYNAMIC STABILITY;
TITANIUM NITRIDE;
TRANSMISSION ELECTRON MICROSCOPY;
GATE DIELECTRICS;
MICROVOIDS;
DIELECTRIC MATERIALS;
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EID: 0035300698
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.40.2810 Document Type: Article |
Times cited : (2)
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References (16)
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