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Volumn 182, Issue 1, 2000, Pages 561-566
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New way to silicon microstructuring with electrochemical etching
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Author keywords
[No Author keywords available]
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Indexed keywords
CRYSTAL MICROSTRUCTURE;
CRYSTAL ORIENTATION;
ELECTROLYTES;
ETCHING;
MORPHOLOGY;
ORGANIC COMPOUNDS;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SCANNING ELECTRON MICROSCOPY;
SILICON WAFERS;
STRESSES;
ELECTROCHEMICAL ETCHING;
MACROPORES;
MECHANICAL STRESS;
TRENCH FORMATION;
POROUS SILICON;
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EID: 0034430824
PISSN: 00318965
EISSN: None
Source Type: Journal
DOI: 10.1002/1521-396X(200011)182:1<561::AID-PSSA561>3.0.CO;2-S Document Type: Article |
Times cited : (13)
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References (16)
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