A percolative approach to reliability of thin films

IEEE Transactions on Electron Devices

Volumn 47, Issue 10, 2000, Pages 1986-1991

  Pennetta, Cecilia ^a   Reggiani, Lino ^a   Trefân, György ^a  

^a UNIVERSITY OF SALENTO   (Italy)

Author keywords

Dielectric breakdown; Electromigration; Failure; Healing; Percolation; Random resistor network; Recovery; Stochastic approach

Indexed keywords

DEGRADATION; ELECTROMIGRATION; FAILURE ANALYSIS; PERCOLATION (SOLID STATE); PROBABILITY; RANDOM PROCESSES; RELIABILITY; SUBSTRATES;

DIELECTRIC BREAKDOWN; DIELECTRIC INSULATORS; RANDOM RESISTOR NETWORK;

THIN FILM DEVICES;

EID: 0034297545     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/16.870586     Document Type: Article

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