Dendrimers with thermally labile end groups: An alternative approach to chemically amplified resist materials designed for sub-100 nm lithography

Advanced Materials

Volumn 12, Issue 15, 2000, Pages 1118-1122

  Tully, David C ^a   Trimble, Alexander R ^a   Fréchet, Jean M J ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MACROMOLECULES; NANOTECHNOLOGY; RESINS;

CHEMICALLY AMPLIFIED RESIST (CAR); DENDRIMERS; THERMALLY LABILE END GROUPS;

PHOTORESISTS;

EID: 0034248790     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/1521-4095(200008)12:15<1118::AID-ADMA1118>3.0.CO;2-I     Document Type: Article

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