Assessing the reliability of die attach materials in electronic packages for high temperature applications

International Conference and Exhibition on High Temperature Electronics 2010, HiTEC 2010

Volumn , Issue , 2010, Pages 1-6

  Sousa, M F ^a   Riches, S ^b   Johnston, C ^a   Grant, P S ^a  

^a UNIVERSITY OF OXFORD   (United Kingdom)

^b GE AVIATION   (United States)

Author keywords

Au Si; Die attach materials; ECAs; High temperature electronics; Modelling; Reliability

Indexed keywords

AU-SI; DIE-ATTACH MATERIALS; ECAS; ELECTRICALLY CONDUCTIVE ADHESIVES; HIGH-TEMPERATURE ELECTRONICS; HIGH-TEMPERATURE EXPOSURE; HIGH-TEMPERATURE PROCESSING; SCANNING ACOUSTIC MICROSCOPY;

ELECTRONICS PACKAGING; FAILURE (MECHANICAL); HIGH TEMPERATURE APPLICATIONS; MATERIALS; MICROELECTRONICS; MODELS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SILICON; SUBSTRATES;

TEMPERATURE;

EID: 84876705698     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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