Dry etching of SIC

Silicon Carbide Micro Electromechanical Systems for Harsh Environments

Volumn , Issue , 2006, Pages 102-127

  Pearton, S J ^a  

^a University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON CARBIDE; SILICON COMPOUNDS;

BASIC PRINCIPLES; ETCH DEPTH; ETCHING RATE; HIGH DENSITY PLASMAS; MEMSDEVICES; WET AND DRY;

DRY ETCHING;

EID: 84967495506     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1142/9781860949098_0004     Document Type: Chapter

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