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Volumn 11, Issue 32, 2015, Pages 3995-4001

Rapid Low-Temperature 3D Integration of Silicon Nanowires on Flexible Substrates

(10) Kim, Yoonkap a Kim, Han Jung a Kim, Jae Hyun a Choi, Dae Geun a Choi, Jun Hyuk a Jung, Joo Yun a Jeon, Sohee a Lee, Eung Sug a Jeong, Jun Ho a Lee, Jihye a

a Korea Institute of Machine and Materials (South Korea)

Author keywords

flexible electronics; graphene; low temperature transfer bonding; silicon nanowires; ultrasonic vibration

Indexed keywords

BONDING; ELECTROMAGNETIC WAVE ABSORPTION; FLEXIBLE ELECTRONICS; GRAPHENE; INTEGRATION; LIGHT ABSORPTION; NANOSTRUCTURES; NANOWIRES; OHMIC CONTACTS; SILICON; TEMPERATURE; THREE DIMENSIONAL INTEGRATED CIRCUITS; ULTRASONIC APPLICATIONS; ULTRASONIC EFFECTS; ULTRASONIC WAVES;

FLEXIBLE ELECTRONIC DEVICES; FLEXIBLE PHOTOVOLTAICS; HIGH INTEGRATION DENSITY; LOW TEMPERATURE BONDING; MECHANICAL AND ELECTRICAL; SILICON NANOWIRES; TRANSFER BONDING; ULTRASONIC VIBRATION;

SUBSTRATES;

EID: 84939572116 PISSN: 16136810 EISSN: 16136829 Source Type: Journal
DOI: 10.1002/smll.201500378 Document Type: Article

Times cited : (3)

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