Soldering method using longitudinal ultrasonic

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 493-498

  Kim, Jung H ^a   Lee, Jihye ^b   Yoo, Choong D ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

Author keywords

Electronic packaging; Localized heating; Longitudinal ultrasonic; Soldering process; Viscoelastic model

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTRONICS PACKAGING; EUTECTICS; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; ULTRASONIC APPLICATIONS; VISCOELASTICITY;

LOCALIZED HEATING; LONGITUDINAL ULTRASONIC; ULTRASONIC SOLDERING; VISCOELASTIC MODEL;

SOLDERING;

EID: 27644463655     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848576     Document Type: Article

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