Mechanical and electrical cold bonding based on metallic nanowire surface fasteners

Nanotechnology

Volumn 23, Issue 36, 2012, Pages

  Ju, Yang ^a   Amano, Masahiro ^a   Chen, Mingji ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AU NANOWIRES; BONDING STRENGTH; COLD BONDING; CRITICAL APPLICATIONS; ELECTRONIC INDUSTRIES; HEATING TEMPERATURES; HIGH MELTING POINT; MASS PRODUCTION; MECHANICAL BONDING; METALLIC NANOWIRES; PARASITIC RESISTANCES; PATTERNED STRUCTURE; PROCESS COMPATIBILITY; RECYCLING OF RARE METALS; RECYCLING RATE; REFLOW--SOLDERING; ROOM TEMPERATURE; SOLDER MATERIAL; SURFACE MOUNT DEVICE; TEMPERATURE RESISTANT;

FLIP CHIP DEVICES; INTERNET PROTOCOLS; LOCKS (FASTENERS); NANOWIRES; RECYCLING; SOLDERING; SURFACE MOUNT TECHNOLOGY; TOXIC MATERIALS;

SURFACES;

EID: 84865409484     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/23/36/365202     Document Type: Article

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