Workload dependent evaluation of thin-film thermoelectric devices for on-chip cooling and energy harvesting

IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

Volumn 2015-January, Issue January, 2015, Pages 535-541

  Choday, Sri Harsha ^a   Kwon, Kon Woo ^a   Roy, Kaushik ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

cooling; energy harvesting; floorplan; frequency boosting; Thin Film Thermoelectrics; workload

Indexed keywords

COMPUTER AIDED DESIGN; COOLING; ENERGY HARVESTING; FLUXES; SIMULATORS; THIN FILMS;

ARCHITECTURAL SIMULATORS; FLOORPLANS; FREQUENCY BOOSTING; HIERARCHICAL SIMULATION; OUT-OF-ORDER PROCESSORS; THERMOELECTRIC MATERIAL; THERMOELECTRICS; WORKLOAD;

THERMAL MANAGEMENT (ELECTRONICS);

EID: 84936885489     PISSN: 10923152     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCAD.2014.7001402     Document Type: Conference Paper

References (22)

1. S. Krishnan, et al., "Towards a thermal moore's law, " Adv. Packaging, IEEE Trans. on, vol. 30, no. 3, Aug. 2007.
2. R. Mahajan, et al., "Cooling a microprocessor chip, " Proc. IEEE, vol. 94 no.8, Aug. 2006
3. E. Rotem, et al., "Power-Management architecture of the intel microarchitecture code-named sandy bridge, " IEEE Micro, vol. 32, no. 2, pp. 20-27, March-April 2012.
4. I. Chowdhury, et al., "On-chip cooling by superlattice-based thin-film thermoelectrics, " Nature Nanotechnology, Letters, vol. 4, Apr. 2009.
5. M. Gupta, et al., "Ultrathin thermoelectric devices for on-chip peltier cooling, " IEEE Transactions on Components and Packaging Technologies, 21 (9), 1395-1405, 2011.
6. S. Choday, et al., "Prospects of thin-film thermoelectric devices for hotspot cooling and on-chip energy harvesting, " IEEE Transactions on Components and Packaging Technologies, vol. 3, no. 12, Dec. 2013.
7. P. Wang, et al., "On-chip hot spot cooling using silicon-based thermoelectric microcooler, " J. Appl. Phys., 2007; 102: 034503.
8. V. Litvinovitch, et al., "Superlattice μTEC hot spot cooling, " IEEE Transactions on Components and Packaging Technologies, vol. 33, no. 1, Mar. 2010.
9. P. Chaparro, et al., "Dynamic thermal management using thin-film thermoelectric cooling, " in Proc. ISLPED 2009.
10. C. J. Vineis, et al., "Nanostructured thermoelectrics: Big Efficiency Gains from Small Features, " Advanced Materials, 2010, 22, 3970-3980.
11. R. Venkatasubramanian, et al., "Thin film thermoelectric devices with high room-Temperature figures of merit, " Nature, vol.413, Oct. 2001.
12. G. E. Bulman, et al., "Large external KT and cooling power densities in thin-film Bi2Te3-superlattice thermoelectric cooling devices, " Appl. Phys. Lett., 89, 122117 (2006)
13. W. Huang, et al., "HotSpot: A Compact Thermal Modeling Methodology for Early-Stage VLSI Design, " IEEE Trans. VLSI, vol.14, no.5 May 2006
14. A. Jain, et al., "A 1.2GHz Alpha Microprocessor with 44.8GB/s Chip Pin Bandwidth, " ISSCC Digest of Technical Papers, Feb. 2001
15. J. A. Kowaleski, et al., "Implementation of an Alpha Microprocessor in SOI, " ISSCC Digest of Technical Papers, Feb. 2003
16. B. A. Gieseke, et al., "A 600MHz Superscalar RlSC Microprocessor with Out-of-Order Execution, " ISSCC Digest of Technical Papers, pp. 176-177, Feb. 1997.
17. R.E. Kessler, "The Alpha 21264 microprocessor, " in Proc. IEEE MICRO, March-April 1999.
18. Simplescalar. (2011) [Online]. Available: http://www.simplescalar.com
19. SPEC2000. (2000) [Online]. Available: http://www.specbench.org
20. S. Li, et al., "McPAT: An integrated power, area, and timing modeling framework for multicore and manycore architectures, " in Proc. IEEE/ACM MICRO, Dec. 2009, pp.469-480.
21. D. M. Rowe, Thermoelectrics Handbook: Macro to Nano, CRC Press, 1st ed., Dec. 2005
22. S. Choday, et al., "Sensitivity analysis and optimization of thin-film thermoelectric coolers, " J. Appl. Phys. 113, 214906 (2013)