Hierarchical indices to detect equipment condition changes with high dimensional data for semiconductor manufacturing

Journal of Intelligent Manufacturing

Volumn 25, Issue 5, 2014, Pages 933-943

  Yu, Hui Chun ^a   Lin, Kuo Yi ^b   Chien, Chen Fu ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Equipment condition; Fault detection and classification (FDC); Manufacturing intelligence; Preventive maintenance (PM); Real time monitoring; Semiconductor manufacturing; Tool health

Indexed keywords

FAULT DETECTION; PREVENTIVE MAINTENANCE; SEMICONDUCTOR DEVICE MANUFACTURE;

EQUIPMENT CONDITIONS; FAULT DETECTION AND CLASSIFICATION; PREVENTIVE MAINTENANCE (PM); REAL TIME MONITORING; SEMICONDUCTOR MANUFACTURING;

EQUIPMENT;

EID: 84906948470     PISSN: 09565515     EISSN: 15728145     Source Type: Journal    
DOI: 10.1007/s10845-013-0785-3     Document Type: Conference Paper

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