Systematic applications of multivariate analysis to monitoring of equipment health in semiconductor manufacturing

Proceedings - Winter Simulation Conference

Volumn , Issue , 2008, Pages 2330-2334

  Chao, A G ^a   Tseng, S T ^a   Wong, D S H ^a   Jang, S S ^a   Lee, S P ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b CHING YUN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BATCH PROCESS; HEALTH INDICES; HOTELLING T2; MEAN SHIFTS; MULTI-VARIATE ANALYSIS; SEMICONDUCTOR MANUFACTURING; STEADY STATE; TRACK AGING;

BATCH DATA PROCESSING; DECISION MAKING; ELECTRIC CONDUCTIVITY; MULTIVARIANT ANALYSIS; SEMICONDUCTOR MATERIALS;

SEMICONDUCTING INDIUM;

EID: 60749123621     PISSN: 08917736     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/WSC.2008.4736338     Document Type: Conference Paper

References (7)

1. Akima, H. 1970. A New Method of Interpolation and Smooth Curve Fitting Based on Local Procedures, Journal of the Association for Computing Machinery 17:589-602.
2. Cherry, G.A, and S.J. Qin 2006. Multiblock principal component analysis based on a combined index for semiconductor fault detection and diagnosis. IEEE Transactions on Semiconductor Manufacturing 19(2):159-171
3. Kaistha, N., C. F. Moore, and M.G. Leitnaker. 2004. "A Statistical Process Control Framework for the Characterization of Variation in Batch Profiles," Technometrics 46:53-67
4. Nomikos, P., and J. F.MacGregor. 1995. Multivariate SPC Charts for Monitoring Batch Processes, Technometrics 37:41-59.
5. Spanos, C.J., and G.S. May. 2006. Fundamentals of Semiconductor Manufacturing and Process Control Wileyley.
6. Smith, J.A., K.C. Lin, M. Richter, U. LevAmi. 2004. Practical, real-time multivariate FDC. Semiconductor International 27(13).
7. Spitzlsperger, G., C. Schmidt, G. Ernst, H. Strasser, and M. Speil. 2005. Fault detection for a via etch process using adaptive multivariate methods. IEEE Transactions on Semiconductor Manufacturing 18(4):528-33.