Cu barrier seed innovation for EM improvement

ECS Transactions

Volumn 60, Issue 1, 2014, Pages 471-476

  He, Weiye ^a   Kang, Jian ^a   Luo, Jeff ^a   Wu, Grant ^a   Zhang, Lei ^a  

^a Applied Materials China   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION BARRIERS; GRAIN BOUNDARIES; PHYSICAL VAPOR DEPOSITION;

CONTINUOUS BARRIER; CONTINUOUS IMPROVEMENTS; CU INTERCONNECT; CURRENT DISTRIBUTION; EFFECTIVE SUPPRESSION; ELECTRON MIGRATION; RESPUTTERING PROCESS; SELF-FORMED BARRIERS;

COPPER ALLOYS;

EID: 84905050956     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/06001.0471ecst     Document Type: Conference Paper

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