Impact of low-k moisture absorption during queue-time on Cu-alloy/low-k reliability and its suppression

2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011

Volumn , Issue , 2011, Pages

  Tsuchiya, H ^a   Yokogawa, S ^a   Kunishima, H ^a   Kuwajima, T ^a   Usami, T ^a   Miura, Y ^a   Ohto, K ^a   Fujii, K ^a   Sakurai, M ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY EFFECT; CU ALLOY; LIFETIME IMPROVEMENT; MOISTURE ABSORPTION; QUEUE TIME; TIME-DEPENDENT DIELECTRIC BREAKDOWN; ULTRA-THIN;

DIELECTRIC MATERIALS; METALLIZING; MOISTURE; SILICON NITRIDE;

ABSORPTION;

EID: 80052072860     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2011.5940293     Document Type: Conference Paper

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