Behavior of the alloying element in Cu interconnects

2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011

Volumn , Issue , 2011, Pages

  Kitao, Ryohei ^a   Noda, Kaori ^a   Nakazawa, Emiko ^a   Tsuchiya, Yasuaki ^a   Fujii, Kunihiro ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AL-CONCENTRATION; CU ALLOY; CU WIRING; CU-AL ALLOYS; CU-INTERCONNECTS; DISSOLVED ALUMINUM; FAILURE RATE; GRAIN SIZE; HEAT TREATMENT CONDITIONS; HIGH RELIABILITY; RELIABILITY IMPROVEMENT;

ALLOYING; ALLOYING ELEMENTS; ALUMINUM; METALLIZING;

COPPER ALLOYS;

EID: 80052041392     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2011.5940332     Document Type: Conference Paper

References (4)

1. Y. Hayashi, et al., IEEE Trans. Semicon. Manuf., 21, 469 (2008).
2. M.Ueki, et al., IEEE IEDM 2008, 619.
3. N. Inoue et al., IEEE IITC 2010, 10.4.
4. M. Tada, et al., J. Electrochemical Society, 154 7 D354-D361 2007