A new enhancement layer to improve copper interconnect performance

2010 IEEE International Interconnect Technology Conference, IITC 2010

Volumn , Issue , 2010, Pages

  Huang, Hung Yi ^a   Hsieh, C H ^a   Jeng, S M ^a   Tao, H J ^a   Cao, Min ^a   Mii, Y J ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CO FILMS; COPPER INTERCONNECTS; CU INTERCONNECT; DUAL DAMASCENE STRUCTURES; ELECTRICAL PERFORMANCE; ENHANCEMENT LAYERS; SEED LAYER;

COBALT; INTERCONNECTION NETWORKS; TANTALUM;

COPPER;

EID: 77955640010     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2010.5510762     Document Type: Conference Paper

References (6)

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