The grand challenges of plasma etching: A manufacturing perspective

Journal of Physics D: Applied Physics

Volumn 47, Issue 27, 2014, Pages

  Lee, Chris G N ^a   Kanarik, Keren J ^a   Gottscho, Richard A ^a  

^a LAM RESEARCH CORPORATION   (United States)

Author keywords

aspect ratio dependent etch; atomic layer etch; grand etch challenges; line width roughness; precision etch

Indexed keywords

ASPECT RATIO; MICROELECTRONICS; PLASMA ETCHING; SILICON WAFERS; SURFACE DEFECTS;

ATOMIC LAYER; ATOMIC LAYER ETCHING; CONTINUOUS INNOVATION; DYNAMIC RANDOM ACCESS MEMORY; EQUIPMENT MANUFACTURERS; GRAND ETCH CHALLENGES; LINEWIDTH ROUGHNESS; MANUFACTURING ENVIRONMENTS;

MANUFACTURE;

EID: 84902826589     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/47/27/273001     Document Type: Review

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