Highly thermal conductive copper nanowire composites with ultralow loading: Toward applications as thermal interface materials

ACS Applied Materials and Interfaces

Volumn 6, Issue 9, 2014, Pages 6481-6486

  Wang, Shouling ^a   Cheng, Yin ^a   Wang, Ranran ^a   Sun, Jing ^a   Gao, Lian ^a  

^a SHANGHAI INSTITUTE OF CERAMICS   (China)

Author keywords

composites; copper nanowires; growth; percolation; thermal conductivity; thermal interface materials

Indexed keywords

ASPECT RATIO; COMPOSITE MATERIALS; COPPER; GROWTH (MATERIALS); INTERFACES (MATERIALS); MICROELECTRONICS; NANOWIRES; PERCOLATION (SOLID STATE); SOLVENTS; THERMAL INSULATING MATERIALS;

COPPER NANOWIRES; FILLING MATERIALS; LARGE ASPECT RATIO; LOW THERMAL CONDUCTIVITY; MODERN MICROELECTRONICS; PERCOLATION THRESHOLDS; SINGLE-CRYSTALLINE; THERMAL INTERFACE MATERIALS;

THERMAL CONDUCTIVITY;

EID: 84900864850     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am500009p     Document Type: Conference Paper

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