Low-temperature large-scale synthesis and electrical testing of ultralong copper nanowires

Langmuir

Volumn 26, Issue 21, 2010, Pages 16496-16502

  Mohl, Melinda ^a   Pusztai, Peter ^a   Kukovecz, Akos ^a   Konya, Zoltan ^a   Kukkola, Jarmo ^b   Kordas, Krisztian ^b   Vajtai, Robert ^c   Ajayan, Pulickel M ^c  

^a UNIVERSITY OF SZEGED   (Hungary)

^b UNIVERSITY OF OULU   (Finland)

^c Rice University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER NANOWIRES; ELECTRICAL PROPERTY; ELECTRICAL TESTING; ENERGY DISPERSIVE X RAY SPECTROSCOPY; HEXADECYLAMINE; HIGH YIELD; HYDROTHERMAL PROCEDURE; LARGE SCALE SYNTHESIS; LOW TEMPERATURES; NANOWIRE GROWTH; SINGLE-CRYSTALLINE; SURFACE STABILIZING AGENTS; UNIFORM DIAMETER;

COPPER; DIFFRACTION; ELECTRIC PROPERTIES; GLUCOSE; LOW TEMPERATURE TESTING; NANOWIRES; SINGLE CRYSTALS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; X RAY SPECTROSCOPY;

ELECTRIC WIRE;

COPPER; NANOWIRE;

ARTICLE; CHEMISTRY; ELECTRICITY; ELECTRODE; PARTICLE SIZE; SURFACE PROPERTY; TEMPERATURE;

COPPER; ELECTRICITY; ELECTRODES; NANOWIRES; PARTICLE SIZE; SURFACE PROPERTIES; TEMPERATURE;

EID: 78049248543     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la101385e     Document Type: Article

References (30)

1. Azarian, A., Irajizad, A., and Dolati, A. Condens. Matter 2007, 19, 446007
2. Jernigan, G. G. and Somorjai, G. A. J. Catal. 1994, 147, 567-577
3. Zhang, Y. W., Huang, W. Y., Habas, S. E., Kuhn, J. N., Grass, M. E., Yamada, Y., Yang, P., and Somorjai, G. A. J. Phys. Chem. C 2008, 112, 12092-12095
4. Fu, S. S. and Somorjai, G. A. J. Phys. Chem. 1992, 96, 4542-4549
5. Somorjai, G. A., York, R. L., Butcher, D., and Park, J. Y. Phys. Chem. Chem. Phys. 2007, 9, 3500-3513
6. Somorjai, G. A., Tao, F., and Park, J. Y. Top. Catal. 2008, 47, 1-14
7. Liu, Z. and Bando, Y. Adv. Mater. 2003, 15, 303-305
8. Choi, H. and Park, S. J. Am. Chem. Soc. 2004, 126, 6248-6249
9. Toimil Molares, M. E., Höhberger, E. M., Schaeflein, Ch., Blick, R., Neumann, H. R., and Trautmann, C. Appl. Phys. Lett. 2003, 82, 2139-2141
10. Toimil Molares, M. E., Buschmann, V., Dobrev, D., Neumann, R., Scholz, R., Schuchert, I. U., and Vetter, J. Adv. Mater. 2001, 13, 62-65
11. Gerein, N. J. and Haber, J. A. J. Phys. Chem. B 2005, 109, 17372-17385
12. Liu, Z., Yang, Y., Liang, J., Hu, Z., Li, S., Peng, S., and Qian, Y. J. Phys. Chem. B 2003, 107, 12658-12661
13. Yen, M., Chiu, C., Hsia, C., Chen, F., Kai, J., Lee, C., and Chiu, H. Adv. Mater. 2003, 15, 235-237
14. Filankembo, A. and Pileni, M. P. J. Phys. Chem. B 2000, 104, 5865-5868
15. Pileni, M. Nat. Mater. 2003, 2, 145-150
16. Dobrev, D., Vetter, J., Angert, N., and Neumann, R. Appl. Phys. A: Mater. Sci. Process. 1999, 69, 233-237
17. Gao, T., Meng, G. W., Zhang, J., Wang, Y. W., Liang, C. H., Fan, J. C., and Zhang, L. D. Appl. Phys. A: Mater. Sci. Process. 2001, 73, 251-254
18. Tian, M., Wang, J., Kurtz, J., Mallouk, T. E., and Chan, M. H. W. Nano Lett. 2003, 3, 919-923
19. Setlur, A. A., Lauerhaas, J. M., Dai, J. Y., and Chang, R. P. H. Appl. Phys. Lett. 1996, 69, 345
20. Zhang, X., Zhang, D., Ni, X., and Zheng, H. Solid State Commun. 2006, 139, 412
21. Zhang, X., Zhang, D., Ni, X., and Zheng, H. Chem. Lett. 2006, 35, 1142
22. Wang, W., Li, G., and Zhang, Z. J. Cryst. Growth 2007, 299, 158-164
23. Shi, Y., Li, H., Chen, L., and Huang, X. Sci. Technol. Adv. Mater. 2005, 6, 761-765
24. Deng, B., Xu, A., Chen, G., Song, R., and Chen, L. J. Phys. Chem. B 2006, 110, 11711
25. Cao, H., Wang, L., Qiu, Y., and Zhang, L. Nanotechnology 2006, 17, 1736-1739
26. Sun, Y., Yin, Y., Mayers, B. T., Herricks, T., and Xia, Y. Chem. Mater. 2002, 14, 4736-4745
27. Wiley, B., Herricks, T., Sun, Y., and Xia, Y. Nano Lett. 2004, 4, 1733-1739
28. Li, Y., Li, X., Deng, Z., Zhou, B., Fan, S., Wang, J., and Sun, X Angew. Chem., Int. Ed. 2002, 41, 333-335
29. Singh, R., Kumar, R., and Chakarvarti, S. K. Phys. E 2008, 40, 591-593
30. Toimil Molares, M. E., Höhberger, E. M., Schaeflein, Ch., Blick, R. H., Neumann, R., and Trautmann, C. Appl. Phys. Lett. 2003, 82, 2139