Thermal conductivity of polystyrene-aluminum nitride composite

Composites - Part A: Applied Science and Manufacturing

Volumn 33, Issue 2, 2002, Pages 289-292

  Yu, Suzhu ^a   Hing, Peter ^a   Hu, Xiao ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Microelectronic packaging materials

Indexed keywords

ALUMINUM NITRIDE; ELECTRONICS PACKAGING; FILLERS; PARTICLE SIZE ANALYSIS; POLYSTYRENES; THERMAL CONDUCTIVITY;

MICROELECTRONIC PACKAGING MATERIALS;

CERAMIC MATRIX COMPOSITES;

EID: 0035242323     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-835X(01)00107-5     Document Type: Article

References (15)

1. Microelectronics technology: Polymers for advanced imaging and packaging