High thermal conductivity epoxy-silver composites based on self-constructed nanostructured metallic networks

Journal of Applied Physics

Volumn 111, Issue 10, 2012, Pages

  Pashayi, Kamyar ^a   Fard, Hafez Raeisi ^a   Lai, Fengyuan ^a   Iruvanti, Sushumna ^b   Plawsky, Joel ^a   Borca Tasciuc, Theodorian ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATED NANOPARTICLES; CONNECTED NETWORKS; CURING PROCESS; FORMATION MECHANISM; HIGH ASPECT RATIO STRUCTURES; HIGH THERMAL CONDUCTIVITY; LOW TEMPERATURES; MICRO-COMPOSITES; MICRO-PARTICLES; NANO-STRUCTURED; NANOSTRUCTURED NETWORKS; ORDERS OF MAGNITUDE; POLYVINYL PYRROLIDONE; PURE EPOXY; THERMAL CONDUCTIVITY MODEL; UPPER LIMIT VALUES;

DIFFERENTIAL SCANNING CALORIMETRY; ELECTRON MICROSCOPY; NANOCOMPOSITES; NANOPARTICLES; SILVER; SINTERING;

THERMAL CONDUCTIVITY;

EID: 84862118779     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4716179     Document Type: Conference Paper

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46. See supplementary material at http://dx.doi.org/10.1063/1.4716179 E-JAPIAU-111-082210 for SEM images of microparticles and nanoparticles, description of sample preparation, SEM of 20 nm nanoparticle powders after sintering, DSC of pure epoxy and PVP, and details of the thermal conductivity setup, measurements and data reduction.