Effects of the size and filler loading on the properties of copper- and silver-nanoparticle-filled epoxy composites

Journal of Applied Polymer Science

Volumn 121, Issue 6, 2011, Pages 3145-3152

  Chan, K L ^a   Mariatti, M ^a   Lockman, Z ^a   Sim, L C ^b  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

^b Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

composites; electron microscopy; fillers; mechanical properties; thermal properties

Indexed keywords

COMPOSITES; ELECTRICAL CONDUCTIVITY; EPOXY COMPOSITE; FILLER LOADING; OPTIMUM PROPERTIES; PERCOLATION THRESHOLDS; SILVER NANOPARTICLES; THERMAL CHARACTERIZATION; THERMAL PROPERTIES;

ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC PROPERTIES; EPOXY RESINS; FILLED POLYMERS; FILLERS; MECHANICAL PROPERTIES; NANOCOMPOSITES; NANOPARTICLES; RESINS; SILVER; SOLVENTS; THERMAL AGING; THERMODYNAMIC PROPERTIES;

LOADING;

EID: 79957888165     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.33798     Document Type: Article

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