Polyaniline/clay as nanostructured conductive filler for electrically conductive epoxy composites. Influence of filler morphology, chemical nature of reagents, and curing conditions on composite conductivity

Synthetic Metals

Volumn 162, Issue 7-8, 2012, Pages 555-562

  Oyharçabal, Mathieu ^a   Olinga, Thomas ^a   Foulc, Marie Pierre ^a   Vigneras, Valérie ^b  

^a RESCOLL   (France)

^b UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

Clay; Electrical properties; Epoxy; Morphology; Polyaniline

Indexed keywords

ANHYDRIDE HARDENERS; CHEMICAL INCOMPATIBILITY; CHEMICAL NATURE; CONDUCTIVE COMPOSITES; CONDUCTIVE EPOXY; CONDUCTIVE FILLERS; CURING CONDITION; ELECTRICAL PERCOLATION THRESHOLD; ELECTRICALLY CONDUCTIVE; EPOXY; LEWIS ACID; NANO-FILLERS; NANO-STRUCTURED;

ALKALINITY; ASPECT RATIO; CLAY; CURING; ELECTRIC PROPERTIES; FILLERS; MORPHOLOGY; POLYANILINE;

EPOXY RESINS;

EID: 84858715700     PISSN: 03796779     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.synthmet.2012.02.011     Document Type: Article

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