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Volumn 23, Issue 1, 2012, Pages 124-129

Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints

Author keywords

[No Author keywords available]

Indexed keywords

IMC LAYER; INTERFACIAL PHASE; INTERMETALLIC COMPOUND LAYER; ISOTHERMAL AGING; KIRKENDALL VOID; SN-3.5AG; SN-3.5AG SOLDERS; SOLDER JOINTS;

EID: 84856963475     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0516-5     Document Type: Article
Times cited : (21)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.