Thermal Interface Materials in Electronic Packaging

Springer Series in Advanced Microelectronics

Volumn 30, Issue , 2011, Pages 305-371

  Tong, Xingcun Colin ^a  

^a Laird Technologies   (United States)

Author keywords

Conductive Filler; Heat Sink; High Thermal Conductivity; Interface Material; Thermal Interface

Indexed keywords

EID: 85103598461     PISSN: 14370387     EISSN: 21976643     Source Type: Book Series    
DOI: 10.1007/978-1-4419-7759-5_8     Document Type: Chapter

References (0)