Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

Journal of Materials Science and Technology

Volumn 27, Issue 8, 2011, Pages 741-745

  Kang, T Y ^a   Xiu, Y Y ^b   Hui, L ^b   Wang, J J ^b   Tong, W P ^a   Liu, C Z ^b  

^a NORTHEASTERN UNIVERSITY   (China)

^b SHENYANG AEROSPACE UNIVERSITY   (China)

Author keywords

Interfacial reaction; Intermetallics; Kinetics; Solder

Indexed keywords

GROWTH PROCESS; INTERMETALLIC COMPOUND GROWTHS; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; PURE SN; SOLDER; SOLDER JOINTS;

ACTIVATION ENERGY; BISMUTH; BISMUTH COMPOUNDS; INTERMETALLICS; LEAD COMPOUNDS; MICROELECTRONICS; REACTION KINETICS; SOLDERING ALLOYS; TIN;

GROWTH KINETICS;

EID: 80052393720     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1005-0302(11)60136-9     Document Type: Article

References (24)

1. Abtew M., Selvaduray G. Mater. Sci. Eng. 2000, 27:95.
2. Vianco P.T., Rejent J.A. J. Electron. Mater. 1999, 28:1127.
3. Vianco P.T., Frear D.L. JOM. 1993, 45:14.
4. Winterbottom W.L. JOM. 1993, 45:20.
5. Yoon J.W., Jung S.B. J. Alloy. Compd. 2003, 359:202.
6. Zhao J., Qi L., Wang X., Wang L. J. Alloy. Compd. 2004, 375:196.
7. Tu K.N., Zeng K. Mater. Sci. Eng. 2001, 34:1.
8. Tu K.N. Mater. Chem. Phys. 1996, 46:217.
9. Vianco P.T., Hlava P.F., Kilgo A.C. J. Electron. Mater. 1994, 23:583.
10. Gong J.C., Liu C.Q., Conway P.P., Silberschmidt V.V. Scripta Mater. 2009, 60:333.
11. Liu C.Z., Zhang W., Sui M.L., Shang J.K. Acta Metall. Sin. 2005, 41:847. (in Chinese).
12. Choi S., Lucas T.R., Lucas J.P., Subramanian K. J. Electron. Mater. 1999, 28:1209.
13. Flanders D.R., Jacobs E.G., Pinizzotto R.F. J. Electron. Mater. 1997, 26:883.
14. Liu C.Z., Chen J., Liu P., Shang J.K. J. Mater. Sci. Technol. 2006, 22:130.
15. Chang K.C., Chiang K.N. J. Electron. Mater. 2004, 33:1373.
16. Raeder C.H., Feton L.E., Tanzi V.A., Knorr D.B. J. Electron. Mater. 1994, 23:611.
17. Pang H.L., Tan K.H., Shi X.Q., Wang Z. Mater. Sci. Eng. A 2001, 307:42.
18. Osamura K., Ochiai S., Kondo S., Namatame M., Nošaki M. J. Mater. Sci. 1986, 21:1509.
19. Tu K.N., Thompson R.D. Acta Metall 1982, 30:947.
20. Vianco P.T., Erickson K.L., Hopkins P.L. J. Electron. Mater. 1994, 23:721.
21. Zhang W., Liu C.Z., Li D.X., Sui M.L. Adv. Eng. Mater. 2004, 4:232.
22. Liu C.Z., Zhang W. J. Mater. Sci. 2009, 44:149.
23. Massalski T.B. Binary Alloy Phase Diagrams 1990, ASM International, Ohio.
24. Feng W.F., Wang C., Morinaga M. J. Electron. Mater. 2002, 31:185.