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Volumn 586, Issue , 2014, Pages 319-327

Effective suppression of interfacial intermetallic compound growth between Sn-58 wt.% Bi solders and Cu substrates by minor Ga addition

Author keywords

Intermetallics; Liquid solid reactions; Metallography; Phase diagrams; Phase transitions; Thermodynamic modeling

Indexed keywords

BINARY ALLOYS; BISMUTH METALLOGRAPHY; COPPER; DIFFUSION BARRIERS; ELECTRON PROBE MICROANALYSIS; GALLIUM; GALLIUM ALLOYS; INTERMETALLICS; LEAD-FREE SOLDERS; METALLOGRAPHY; PHASE DIAGRAMS; PHASE TRANSITIONS; SUBSTRATES; TIN ALLOYS; TIN METALLOGRAPHY;

EID: 84887041682     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2013.10.035     Document Type: Article
Times cited : (58)

References (38)
  • 10
    • 0003171562 scopus 로고
    • Alloy Phase Diagram
    • ASM International New York
    • H. Okamoto Alloy Phase Diagram ASM Handbook 1990 ASM International New York
    • (1990) ASM Handbook
    • Okamoto, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.