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Volumn 586, Issue , 2014, Pages 319-327
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Effective suppression of interfacial intermetallic compound growth between Sn-58 wt.% Bi solders and Cu substrates by minor Ga addition
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Author keywords
Intermetallics; Liquid solid reactions; Metallography; Phase diagrams; Phase transitions; Thermodynamic modeling
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Indexed keywords
BINARY ALLOYS;
BISMUTH METALLOGRAPHY;
COPPER;
DIFFUSION BARRIERS;
ELECTRON PROBE MICROANALYSIS;
GALLIUM;
GALLIUM ALLOYS;
INTERMETALLICS;
LEAD-FREE SOLDERS;
METALLOGRAPHY;
PHASE DIAGRAMS;
PHASE TRANSITIONS;
SUBSTRATES;
TIN ALLOYS;
TIN METALLOGRAPHY;
ACTIVE ELEMENTS;
CALPHAD THERMODYNAMIC MODELING;
DIFFUSION PATHS;
EFFECTIVE SUPPRESSION;
ELECTRONIC PRODUCT;
INTERFACIAL INTERMETALLICS;
LIQUID-SOLID REACTION;
THERMODYNAMIC MODEL;
COPPER METALLOGRAPHY;
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EID: 84887041682
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2013.10.035 Document Type: Article |
Times cited : (58)
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References (38)
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