Atomic interdiffusion and diffusive stabilization of cobalt by copper during atomic layer deposition from Bis(N - Tert -butyl- N′- ethylpropionamidinato) cobalt(II)

Journal of Physical Chemistry Letters

Volumn 5, Issue 7, 2014, Pages 1091-1095

  Elko Hansen, Tyler D M ^a   Dolocan, Andrei ^a   Ekerdt, John G ^a  

^a The University of Texas at Austin   (United States)

Author keywords

ALD; capping layer; cobalt; copper; electromigration; ToF SIMS

Indexed keywords

ALD; ATOMIC INTERDIFFUSION; CAPPING LAYER; CRYSTAL FORMATION; FREE SURFACE ENERGY; TIME OF FLIGHT SECONDARY ION MASS SPECTROMETRY; TOF SIMS; ULTRATHIN COBALT FILMS;

ATOMIC LAYER DEPOSITION; COPPER; DEPOSITION; ELECTROMIGRATION; FILM GROWTH; GRAIN BOUNDARIES; METALLIC FILMS; PHOTOELECTRONS; SECONDARY ION MASS SPECTROMETRY; ULTRATHIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

COBALT;

EID: 84898062993     PISSN: None     EISSN: 19487185     Source Type: Journal    
DOI: 10.1021/jz500281k     Document Type: Article

References (23)

1. Moon, P.; Dubin, V.; Johnston, S.; Leu, J.; Raol, K.; Wu, C. Process Roadmap and Challenges for Metal Barriers IEEE Int. Electron Devices Meet. 2003, 841-844
2. Gordon, R. G.; Kim, H.; Bhandari, H. Cobalt Nitride Layers for Copper Interconnects and Methods for Forming Them. US Patent 7,973,789 B2, 2011.
3. Kohn, A.; Eizenberg, M.; Shacham-Diamand, Y. Copper Grain Boundary Diffusion in Electroless Deposited Cobalt Based Films and Its Influence on Diffusion Barrier Integrity for Copper Metallization J. Appl. Phys. 2003, 94, 3015-3024
4. Hau-Riege, C. S. An Introduction to Cu Electromigration Microelectron. Reliab. 2004, 44, 195-205
5. International Technology Roadmap for Semiconductors, 2011, ed.; Sematech International.
6. Tonner, B. P.; Han, Z.-L.; Zhang, J. Structure of Co Films Grown on Cu(111) Studied by Photoelectron Diffraction Phys. Rev. B 1993, 47, 9723-9732
7. Lamelas, F. J.; Lee, C. H.; He, H.; Vavra, W.; Clarke, R. Coherent Fcc Stacking in Epitaxial Co/Cu Superlattices Phys. Rev. B 1989, 40, 5837-5840
8. Christensen, A.; Ruban, A. V; Stoltze, P.; Jacobsen, K. W.; Skriver, H. L.; No, J. K.; Besenbacher, F. Phase Diagrams for Surface Alloys Phys. Rev. B 1997, 56, 5822-5834 (Pubitemid 127489375)
9. Zhang, L.; Kraatz, M.; Aubel, O.; Hennesthal, C.; Im, J.; Zschech, E.; Ho, P. S. Cap Layer and Grain Size Effects on Electromigration Reliability in Cu/Low-k Interconnects IEEE Int. Interconnect Technol. Conf. 2010, 1-3
10. Shimizu, H.; Sakoda, K.; Momose, T.; Shimogaki, Y. Atomic Layer Deposited Co(W) Film as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects Jpn. J. Appl. Phys. 2012, 51, 1-7
11. Yang, C.-C.; Flaitz, P.; Wang, P.-C.; Chen, F.; Edelstein, D. Characterization of Selectively Deposited Cobalt Capping Layers: Selectivity and Electromigration Resistance IEEE Electron Device Lett. 2010, 31, 728-730
12. Chioncel, M. F.; Haycock, P. W. Structural Characterization of Cobalt Thin Films Grown by Metal-Organic CVD Chem. Vap. Deposition 2005, 11, 235-243 (Pubitemid 40844292)
13. Lim, B. S.; Rahtu, A.; Gordon, R. G. Atomic Layer Deposition of Transition Metals Nat. Mater. 2003, 2, 749-754
14. Bhandari, H. B.; Yang, J.; Kim, H.; Lin, Y.; Gordon, R. G.; Wang, Q. M.; Lehn, J.-S. M.; Li, H.; Shenai, D. Chemical Vapor Deposition of Cobalt Nitride and its Application as an Adhesion-Enhancing Layer for Advanced Copper Interconnects ECS J. Solid State Sci. Technol. 2012, 1, N79-N84
15. Zimmerman, J. D.; Lassiter, B. E.; Xiao, X.; Sun, K.; Dolocan, A.; Gearba, R.; Vanden Bout, D. a; Stevenson, K. J.; Wickramasinghe, P.; Thompson, M. E. Control of Interface Order by Inverse Quasi-Epitaxial Growth of Squaraine/Fullerene Thin Film Photovoltaics ACS Nano 2013, 7, 9268-9275
16. 2C/Pt Photocathodes for the Hydrogen Evolution Reaction J. Am. Chem. Soc. 2014, 136, 1535-1544
17. Hofmann, S. Profile Reconstruction in Sputter Depth Profiling Thin Solid Films 2001, 398-399, 336-342 (Pubitemid 33107113)
18. Vitos, L.; Ruban, A. V; Skriver, H. L.; Kolla, J. The Surface Energy of Metals Surf. Sci. 1998, 411, 186-202 (Pubitemid 128431152)
19. Venables, J. A. Introduction to Surface and Thin Film Processes; Cambridge University Press: New York, 2000.
20. Li, H.; Tonner, B. P. Structure and Growth Mode of Metastable FCC Cobalt Ultrathin Films on Cu (001) as Determined by Angle-Resolved X-Ray Photoemission Scattering Surf. Sci. 1990, 237, 141-152
21. Nilsen, O.; Karlsen, O. B.; Kjekshus, A.; Fjellvg, H. Simulation of Growth Dynamics for Nearly Epitaxial Films J. Cryst. Growth 2007, 308, 366-375 (Pubitemid 47575540)
22. Nilsen, O.; Karlsen, O. B.; Kjekshus, A.; Fjellvg, H. Simulation of Growth Dynamics in Atomic Layer Deposition. Part I. Amorphous Films Thin Solid Films 2007, 515, 4527-4537 (Pubitemid 46282000)
23. Deo, N.; Bain, M. F.; Montgomery, J. H.; Gamble, H. S. Study of Magnetic Properties of Thin Cobalt Films Deposited by Chemical Vapour Deposition J. Mater. Sci. Mater. Electron. 2005, 16, 387-392 (Pubitemid 41320042)